| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-wiring board capable of reducing the cost of the printed-wiring board. <P>SOLUTION: A manufacturing method of a printed-wiring board comprises: a first step S10 of preparing a laminate 20 including an insulating layer 21 having a first rough surface 211 and a conductive layer 22 having a second rough surface 221 closely adhering to the first rough surface 211 nad laminated on the insulating layer 21; a second step S20 of etching the conductive layer 22 so that the conductive layer 22 of a prescribed thickness t<SB POS="POST">0</SB>remains; a third step S30 of forming a resist layer 23 on the conductive layer 22; a fourth step S40 of forming a plating layer 24 on a region 222 exposed from the resist layer 23 in the conductive layer 222 using the conductive layer 22 as a power supply layer; a fifth step S50 of removing the resist layer 23 from the conductive layer 22; and a sixth step S60 of removing a region 223 exposed from the plating layer 24 in the conductive layer 22. <P>COPYRIGHT: (C)2013,JPO&INPIT |
