发明名称 ELECTRONIC COMPONENT ATTACHMENT DEVICE, AND ELECTRONIC COMPONENT ATTACHMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To mount an electronic component efficiently while preventing interference of respective attachment heads, in an electronic component attachment device having a plurality of lanes capable of independent production by dual conveyance. <P>SOLUTION: For each step described in the attachment data, priority for each beam is compared, and the steps of attraction, recognition, and attachment for an attachment head of a high priority beam are performed until the end of cycle. For an attachment head of a low priority beam, a determination is made as to whether or not the beam interferes with the other beam, only the steps not interfering with the other beam is executed, and execution of steps interfering with the other beam is waited until the beam does not interfere with the other beam. When a running cycle finishes for a pair of beams, a priority lower than that of the other beam is imparted with reference to the priority of the other beam. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013038281(A) 申请公布日期 2013.02.21
申请号 JP20110174377 申请日期 2011.08.09
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 ONISHI SEIJI;IZUMIHARA KOICHI;KAMEDA MAKIO
分类号 H05K13/04 主分类号 H05K13/04
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