| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition that can form an interlayer insulating layer high in bond strength to a plated conductive layer, and excellent in insulation reliability; a dry film using the same; and a multilayer printed wiring board having the interlayer insulating layer formed through these. <P>SOLUTION: This thermosetting resin composition for the interlayer insulation material of the multilayer printed wiring board includes as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, and liquid at 20°C, (B) a solid epoxy resin having three or more epoxy groups in one molecule, and solid at 40°C; (C) a semi-solid epoxy resin having two or more epoxy groups in one molecule, and showing solid state at 20°C and liquid state at 40°C; (D) an epoxy curing agent; and (E) a filler. The three epoxy resins are contained, in mass ratio, (A):(B+C)=1:1 to 1:10, and (B):(C)=1:0.5 to 1:2. Preferably the component (A) and the component (B) are contained, in mass ratio, (A):(B)=1:0.5 to 1:5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
