| 摘要 |
<P>PROBLEM TO BE SOLVED: To minimize the deformation of a printed circuit board or the stress loading on a semiconductor switch element by reducing the pressing force from a heat dissipation sheet. <P>SOLUTION: Semiconductor switch elements 23-26 are mounted on the lower surface 12b of a printed circuit board 12, a heat dissipation sheet 21 is bonded to a position on the upper surface 12a where each semiconductor switch element is located, and heat is transmitted by pressing the upper surface of the heat dissipation sheet with a cover member 4. On the upper wall 4a of the cover member, a pyramidal convex part 27 is formed so that the lower surface 27a thereof adheres to the upper surface of the heat dissipation sheet, and a protrusion 27b is formed substantially in the center of the convex part to protrude in the direction of the heat dissipation sheet. The protrusion is set at the position of a clearance S between the semiconductor switch elements 24, 25. <P>COPYRIGHT: (C)2013,JPO&INPIT |
