发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having excellent characteristics by using an oxide semiconductor having high crystallinity for a channel layer; and provide a semiconductor device which improves flatness of a base film. <P>SOLUTION: A semiconductor device manufacturing method comprises performing chemical mechanical polishing processing on a base film of a transistor; and performing a plasma treatment after performing chemical mechanical polishing processing to allow center line average roughness Ra<SB POS="POST">75</SB>value of the base film to be below 0.1 nm. The manufacturing method further comprises forming an oxide semiconductor layer having high crystallinity on the base film having flatness obtained by a combination of the plasma treatment and the chemical mechanical polishing processing thereby to achieve improvement of characteristics of the semiconductor device. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013038404(A) |
申请公布日期 |
2013.02.21 |
申请号 |
JP20120152279 |
申请日期 |
2012.07.06 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
ISHIZUKA AKIHIRO;HANAOKA KAZUYA;SASAGAWA SHINYA;NAGAMATSU SHO |
分类号 |
H01L21/336;H01L29/786;H01L51/50 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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