发明名称 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having excellent characteristics by using an oxide semiconductor having high crystallinity for a channel layer; and provide a semiconductor device which improves flatness of a base film. <P>SOLUTION: A semiconductor device manufacturing method comprises performing chemical mechanical polishing processing on a base film of a transistor; and performing a plasma treatment after performing chemical mechanical polishing processing to allow center line average roughness Ra<SB POS="POST">75</SB>value of the base film to be below 0.1 nm. The manufacturing method further comprises forming an oxide semiconductor layer having high crystallinity on the base film having flatness obtained by a combination of the plasma treatment and the chemical mechanical polishing processing thereby to achieve improvement of characteristics of the semiconductor device. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013038404(A) 申请公布日期 2013.02.21
申请号 JP20120152279 申请日期 2012.07.06
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 ISHIZUKA AKIHIRO;HANAOKA KAZUYA;SASAGAWA SHINYA;NAGAMATSU SHO
分类号 H01L21/336;H01L29/786;H01L51/50 主分类号 H01L21/336
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