| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of more reducing generation of unwanted radiation noise during operation than before. <P>SOLUTION: A multilayer printed wiring board includes a power supply layer 24 divided into conductor patterns 14, 16, and 18 by providing an insulated discontinuous part, and supplying different drive voltages for every conductor patterns 14, 16, and 18 to electronic components to be mounted in inner layers. A plurality of inter-power-source bypass capacitors 12 for connecting the conductor patterns 14, 16, and 18 in a high frequency manner are mounted on a surface vertically moved in parallel to a surface with a discontinuous part in the inner layers, and/or inter-power-ground bypass capacitors 52 for connecting a GND layer 36 with the conductor patterns 14, 16, and 18 in a high frequency manner are mounted on an inner layer surface vertically moved in parallel to peripheral edges of the conductor patterns 14, 16, and 18. <P>COPYRIGHT: (C)2013,JPO&INPIT |
