| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable electronic device and a method for manufacturing the same. <P>SOLUTION: The method for manufacturing an electronic device comprises the steps of: forming a structure 2 in which, on one surface side of a resin layer 18 having electronic components 14a-14c embedded therein, bumps 42 electrically connected to the electronic components are formed, and a member 44 having a higher elastic modulus than the resin layer is in close contact with the other surface side of the resin layer; and applying ultrasonic vibration via the member in a state where electrodes 48 formed on a substrate 46 are in contact with the bumps, to join the bumps and the electrodes together. <P>COPYRIGHT: (C)2013,JPO&INPIT |
