| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal substrate which enables a semiconductor chip serving as a light source to be securely joined with a metal joining material and efficiently radiates heat generated from the mounted semiconductor chip through a metal plate. <P>SOLUTION: A metal substrate has a light source mounting surface for mounting a semiconductor chip serving as a light source. The metal substrate has a heat radiation metal plate formed by a metal other than Au, a white film laminated on a part of the heat radiation plate and made of an insulation resin, and a light source mounting surface formation layer laminated on another part of the heat radiation metal plate. The light source mounting surface formation layer is a metal layer directly connecting with the heat radiation plate, and the light source mounting surface is a surface of an Au layer forming the outmost layer of the light source mounting surface formation layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
