发明名称 SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor storage device and a manufacturing method of the same, which can improve reliability. <P>SOLUTION: A semiconductor storage device according to an embodiment comprises: laminates including a laminated plurality of gate electrodes and an insulation film provided between the gate electrodes; and a plurality of memory cells provided in a lamination direction and including semiconductor pillars penetrating the laminate, a charge storage layer provided between the semiconductor pillars and the gate electrode via an air gap, and a block insulation layer provided between the charge storage layers and the gate electrode. In each of the memory cells, a support part for maintaining a distance between the charge storage layer and the semiconductor pillar is provided. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013038124(A) 申请公布日期 2013.02.21
申请号 JP20110171087 申请日期 2011.08.04
申请人 TOSHIBA CORP 发明人 KIYOTOSHI MASAHIRO
分类号 H01L21/8247;H01L21/336;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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