发明名称 |
Dual Cure Thermally Conductive Adhesive |
摘要 |
A thermally conductive adhesive for use in connection with heat-generating electronic components includes an unsaturated carbonyl containing compound combined with a thiol containing compound blended with thermally conductive fillers. The adhesive is fully curable with UV light exposure or within 48 hours at room temperature. The combination of the two different cure methods in this adhesive facilitates rapid and energy efficient manufacturing. |
申请公布号 |
US2013042972(A1) |
申请公布日期 |
2013.02.21 |
申请号 |
US201113210545 |
申请日期 |
2011.08.16 |
申请人 |
TIMMERMAN JOHN;MISRA SANJAY |
发明人 |
TIMMERMAN JOHN;MISRA SANJAY |
分类号 |
B32B37/12;C09J9/00;C09J175/14;C09J181/00;C09J183/16 |
主分类号 |
B32B37/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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