发明名称 |
SEMICONDUCTOR PACKAGE CONTAINING SILICON-ON-INSULATOR |
摘要 |
Thermal transfer from a silicon^m-insulator (SOI) die is improved by mounting the die in a bump-on-Iead.frame manner in a semiconductor package, with solder or other metal bumps connecting the active layer of the SOI die to metal leads used to mount the package on a printed circuit board or other support structure. |
申请公布号 |
WO2013025575(A1) |
申请公布日期 |
2013.02.21 |
申请号 |
WO2012US50496 |
申请日期 |
2012.08.12 |
申请人 |
ADVANCED ANALOGIC TECHNOLOGIES, INC.;WILLIAMS, RICHARD, K. |
发明人 |
WILLIAMS, RICHARD, K. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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