MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, FILM GLUE, AND ADHESIVE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device by flip-chip mounting, and a film glue and an adhesive sheet used for the same.

SOLUTION: A manufacturing method of a semiconductor device comprises: a first step of obtaining a semiconductor wafer 20 with an adhesive layer by providing an adhesive layer 2 on a functional surface of the semiconductor wafer having a functional surface on which solder bumps are formed; a second step of thinning the semiconductor wafer 20 by grinding the surface on the side opposite to the functional surface of the semiconductor wafer 20 with the adhesive layer; a third step of obtaining a semiconductor element with an adhesive layer by slicing the thinned semiconductor wafer 20 into a plurality of semiconductor elements by cutting the semiconductor wafer 20 together with the adhesive layer 2; a fourth step of pressurizing the semiconductor element with the adhesive layer and other semiconductor elements having an electrode or a support member 4 for mounting a semiconductor element having an electrode at a temperature lower than a melting point of solders of the solder bumps 22 in a direction in which the solder bumps 22 and the electrode are opposed to each other; and a fifth step of bonding the solder bumps 22 and the electrode by melting the solders of the solder bumps 22 by heating.

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