发明名称 SILVER PARTICLE DISPERSION COMPOSITION, CONDUCTIVE CIRCUIT USING THE SAME AND FORMATION METHOD OF CONDUCTIVE CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To provide a metallic particle dispersion composition combining low temperature sinterability and dispersibility of a polar solvent. <P>SOLUTION: The metallic particle dispersion composition contains metal nanoparticles having an average particle size of 1-100 nm in which an organic material having an amino group exists on the particle surface, a compound represented by the formula (1), and a dispersion solvent. In the formula (1), R represents an alkyl radical having a branch chain and/or an alkyl radical of 1-24C containing an alkenyl group and/or an alkenyl group, AO represents an oxyalkylene of 1-4C, n represents a value of 1 or more and less than 20 representing the average addition mol number of alkylene oxide, and X represents a coupling group composed of any one of C, H, or O atom. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013037773(A) 申请公布日期 2013.02.21
申请号 JP20110170336 申请日期 2011.08.03
申请人 DAI ICHI KOGYO SEIYAKU CO LTD;DOWA ELECTRONICS MATERIALS CO LTD 发明人 KATO KAZUYUKI;SAITO YASUTERU;OMOTO MASANORI;SASAKI SHINYA;SHIBAYAMA TOMONORI
分类号 H01B1/22;B22F1/02;B22F9/00;B82Y30/00;H01B1/00;H01B5/14;H01B13/00;H01L23/14;H05K1/09;H05K3/12 主分类号 H01B1/22
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