| 摘要 |
A thermal conduction path for a heat-sensitive, heat-generating component is formed by placing a heat-generating device, such as a laser diode, in a desired orientation relative to a supporting surface. A solid-phase mass of a heat-conducting material is positioned between the heat-generating device and the supporting surface and is converted to liquid phase by heating the supporting surface. Additional heat-conducting material is then added to the liquid-phase heat-conducting material until a meniscus is formed between the heat-generating component and the supporting surface. Because the heat-conducting material has a melting point or liquidus that is less than a critical temperature of the heat-generating component, the thermal conduction path can be formed without damaging the heat-generating component.
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