| 发明名称 |
SOLDER ADHESIVE BODY, PRODUCTION METHOD FOR SOLDER ADHESIVE BODY, ELEMENT, SOLAR CELL, PRODUCTION METHOD FOR ELEMENT, AND PRODUCTION METHOD FOR SOLAR CELL |
| 摘要 |
<p>The solder adhesive body of present invention has: an oxide adherend having an oxide layer on the surface; and a solder layer bonded to the oxide layer, the solder layer being an alloy having a melting point of less than 450ºC, including at least two metals selected from the group consisting of tin, copper, silver, bismuth, lead, aluminum, titanium, and silicon, and having a zinc content of 1 mass% or less.</p> |
| 申请公布号 |
WO2013024829(A1) |
申请公布日期 |
2013.02.21 |
| 申请号 |
WO2012JP70560 |
申请日期 |
2012.08.10 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;KURIHARA, YOSHIAKI;YOSHIDA, MASATO;NOJIRI, TAKESHI;KURATA, YASUSHI;ADACHI, SHUICHIRO;KATO, TAKAHIKO |
发明人 |
KURIHARA, YOSHIAKI;YOSHIDA, MASATO;NOJIRI, TAKESHI;KURATA, YASUSHI;ADACHI, SHUICHIRO;KATO, TAKAHIKO |
| 分类号 |
B23K1/19;B23K1/00;B23K35/26;B32B15/04;H01L31/04 |
主分类号 |
B23K1/19 |
| 代理机构 |
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