METHOD FOR MANUFACTURING WIRING PATTERN, AND MEMBER FOR PLATING

摘要

A method for manufacturing a wiring pattern comprises the steps of: selectively forming a parent plating layer (13) on an optically transparent support (2), the parent plating layer including an optically transparent base material and alumina particles having an average particle diameter of 100 nm or less; causing a catalyst to be supported on at least a portion of the surface of the parent plating layer (13); and bringing an electroless plating solution into contact with the surface of the parent plating layer (13) and performing electroless plating.