| 摘要 |
<p>This backlight device (12) is provided with: a plurality of LEDs (17); an LED substrate (18); a chassis (14); patterned wiring (31); a solder resist layer (32) formed so that the layer thickness thereof, when viewed in the entire plane of a bottom plate (14a) of the chassis (14), is relatively smaller at a portion of the chassis (14) located further towards the center side relative to the portion located the end-section side, than at the portion located at the end-section side; and a reflecting sheet (21) having a light reflectivity higher than that of the solder resist layer (32), the reflecting sheet (21) having a plurality of lens through-holes (21d) for revealing the LEDs (17), the opening area of the lens through-holes (21d) being relatively larger for a lens through-hole (45) that overlaps a portion of the solder resist layer (32) located towards the center side than for a lens through-hole (44) that overlaps a portion of the solder resist layer (32) located towards the end-section side.</p> |
