发明名称 LOWER RECEIVING PIN MODULE FOR ELECTRONIC COMPONENT MOUNTING DEVICE, SUBSTRATE LOWER RECEIVING DEVICE, AND SUBSTRATE LOWER RECEIVING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a lower receiving pin module for an electronic component mounting device capable of automating the pin arrangement alteration work efficiently with a simple configuration, and to provide a substrate lower receiving device and a substrate lower receiving method. <P>SOLUTION: A lower receiving pin module 22 standing at an arbitrary position of a lower receiving base 21 having an upper surface provided with a magnetic material 21a and receiving and supporting a substrate from below includes a base 23 which incorporates a magnet member 26 having permanent magnetism so as to be able to lift or lower freely and is secured to the lower receiving base 21 by magnetic attraction in a state where the magnet member 26 has lowered, and a hollow shaft member 24 provided to extend upward from the base 23 and a top member 25 at the upper end of which abuts against the lower surface of the substrate, thus supporting the substrate. The magnet member 26 is lifted or lowered by vacuum suction from a suction hole 25c, thus securing or releasing the base 23 to or from the lower receiving base 21. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013038205(A) 申请公布日期 2013.02.21
申请号 JP20110172781 申请日期 2011.08.08
申请人 PANASONIC CORP 发明人 YAMASHITA SHIRO;ENDO TADASHI;KINOSHITA KOJI
分类号 H05K13/04 主分类号 H05K13/04
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