| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve dehumidifying properties of a resin layer of a semiconductor device where a shield layer is provided on a surface of the resin layer for sealing electronic components. <P>SOLUTION: A semiconductor device 100c includes: a substrate 110; and an electronic component 120 mounted on the substrate 110. The electronic component 120 on the substrate 110 is sealed by a resin layer 130, and a shield layer 140 for shielding electromagnetic waves is provided on an upper surface and a side surface of the resin layer 130. Holes 131, 141 which communicate with each other are provided in the resin layer 130 and the shield layer 140, and pins 180 are inserted into the holes. When each pin 180 is thermally expanded by heating, a gap 200 is formed. Moisture contained in the resin layer 130 is eliminated to the exterior through the holes 131, 141 and the gaps 200. <P>COPYRIGHT: (C)2013,JPO&INPIT |
