| 摘要 |
<P>PROBLEM TO BE SOLVED: To avoid a limitation of a laser irradiation enabled area and enhance a cutting efficiency and convenience. <P>SOLUTION: A cutting apparatus 1 includes a guide rail 18 circularly formed along a circumference centered around a spindle 10c of a cutting driving unit 10, a laser irradiation unit 22 movably formed along the guide rail and irradiating a cutting object 30 with laser at a predetermined inclination angle, a predetermined cutting position deriving unit 26a deriving a predetermined cutting position corresponding to a predetermined cutting area which is a cutting area by a cutting tool 10b after a predetermined time, a stopping position deriving unit 26b deriving a stopping position of the laser irradiation unit on the guide rail targeting the derived predetermined cutting position, and a laser irradiation driving unit 24 moving the laser irradiation unit to the derived stopping position. The limitation of the laser irradiation enabled area is avoided and the predetermined cutting area is preheated reliably by rotating the laser irradiation unit, centering around the spindle. <P>COPYRIGHT: (C)2013,JPO&INPIT |
