| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board having high adhesion force between an insulating resin layer and a wiring conductor and capable of obtaining a wiring board in which smears in a hole such as a via hole were sufficiently removed although irregularity of a surface of the insulating resin layer is small. <P>SOLUTION: A manufacturing method of a printed wiring board having insulating resin layers and a wiring formed on surfaces of the insulating resin layers comprises: a laminate formation step of forming a laminate having insulating resin layer 4 and a support body 9; a hole formation step of providing holes 6 and 7 on the laminate; a desmear processing step of removing smears in the holes with a desmear processing liquid; a support body removal step of removing the support body from the laminate; a wiring formation step of forming a wiring 5 on surfaces of the insulating resin layers from which the support body was removed among the insulating resin layers; and an ultraviolet light irradiation step of improving adhesion force for the wiring by irradiating the insulating resin layers with irradiation light after the laminate formation step and before the wiring formation step. <P>COPYRIGHT: (C)2013,JPO&INPIT |
