| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a casting epoxy resin composition superior in flowability as well as in thermal conductivity. <P>SOLUTION: The casting epoxy resin composition is characterized by containing: an epoxy resin showing a liquid state at room temperature and having two or more epoxy groups per molecule; an epoxy resin curing agent showing a liquid state at room temperature; a plate-like inorganic filler; and a spherical alumina filler. The plate-like inorganic filler and spherical inorganic filler have two or more maximal points in a particle distribution as a whole, and the mass ratio of the plate-like inorganic filler is 5-20 mass% of the total mass of the inorganic filler, the total mass being obtained by totalizing the masses of the plate-like inorganic filler and spherical inorganic filler combined together. <P>COPYRIGHT: (C)2013,JPO&INPIT |
