| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering reflow device capable of mounting printed-wiring boards having difference widths on a transfer carrier and continuously doing soldering work when soldering the printed-wiring boards by using the transfer carrier. <P>SOLUTION: A soldering reflow device comprises: a first conveyance path which conveys a substrate to/from a soldering reflow furnace 1; a carrying-in device 21 which mounts the substrate on a transfer carrier and carries the transfer carrier into the first conveyance path; a carrying-out device 22 which carries out the substrate from the transport carrier to a conveyance path of the next step; an adjustment device 23 for adjusting a transport carrier width dimension which adjusts the mounting width of the substrate of the transport carrier installed in the carrying-in device 21; a tag reader which reads information from an IC tag of the substrate; a control device 25 which instructs the adjustment device 23 for adjusting the transport carrier width dimension to adjust the width dimension on the basis of the substrate width information read by the tag reader; and a cooling device 24 which is installed in a second conveyance path which conveys the transport carrier and cools the transport carrier to a prescribed temperature. <P>COPYRIGHT: (C)2013,JPO&INPIT |
