发明名称 SHIELDED GATE TRENCH MOSFET PACKAGE
摘要 A shielded gate trench field effect transistor can be formed on a substrate having an epitaxial layer on the substrate and a body layer on the epitaxial layer. A trench formed in the body layer and epitaxial layer is lined with a dielectric layer. A shield electrode is formed within a lower portion of the trench. The shield electrode is insulated by the dielectric layer. A gate electrode is formed in the trench above the shield electrode and insulated from the shield electrode by an additional dielectric layer. One or more source regions formed within the body layer is adjacent a sidewall of the trench. A source pad formed above the body layer is electrically connected to the one or more source regions and insulated from the gate electrode and shield electrode. The source pad provides an external contact to the source region. A gate pad provides an external contact to the gate electrode. A shield electrode pad provides an external contact to the shield electrode. A resistive element can be electrically connected between the shield electrode pad and the source lead in the package.
申请公布号 US2013043527(A1) 申请公布日期 2013.02.21
申请号 US201113212940 申请日期 2011.08.18
申请人 LUI SIK;SU YI;NG DANIEL;CALAFUT DANIEL;BHALLA ANUP 发明人 LUI SIK;SU YI;NG DANIEL;CALAFUT DANIEL;BHALLA ANUP
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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