| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip component structure which enables easy structural design and mounting and has mounting strength and electric characteristics that are equivalent to conventional and general mounting structures, and to provide a manufacturing method of the chip component structure. <P>SOLUTION: A multilayer ceramic capacitor 20 has a structure formed by laminating a predetermined number of tabular internal electrodes 200. An interposer 30 includes a substrate 31 larger than an outer shape of the multilayer ceramic capacitor 20. First surface electrodes 321, 331 for mounting the multilayer ceramic capacitor 20 are formed on a first main surface of a substrate 31, and first rear surface electrodes 322, 332 for connecting with an external circuit board 90 are formed on a second main surface. A recessed part 310 is formed on a side surface of the interposer 30, and a connection conductor 343 is formed on a wall surface of the recessed part 310. Resist films 321A, 331A are formed on the surface of the substrate 31 so as to be arranged along edge parts. <P>COPYRIGHT: (C)2013,JPO&INPIT |
