| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can correctly check a state of bonding with an encapsulation resin or a state of solder bonding at a boundary surface of a middle-side electrode. <P>SOLUTION: A semiconductor device comprises: a low-side electrode 40 and a first middle-side electrode 50 provided so as to sandwich a first semiconductor element 10 from both sides; a first resin mold 110 molded by an encapsulation resin 100 so as to expose an outer surface of each of the low-side electrode 40 and the first middle-side electrode 50; a second middle-side electrode 51 provided so as to sandwich a second semiconductor element 11 from both sides; and a second resin mold 120 molded by the encapsulation resin so as to expose an outer surface of each of the high-side electrode 60 and the second middle-side electrode 51. The outer surfaces of the first middle-side electrode 50 and the second middle-side electrode 51 are integrally fixed and electrically connected by bonding or by insulation displacement contact. <P>COPYRIGHT: (C)2013,JPO&INPIT |
