| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a white curable composition for an optical semiconductor device, by which a molded product with good processability can be obtained and the adhesiveness of the molded product to a lead frame can be enhanced. <P>SOLUTION: The white curable composition for a semiconductor device comprises: an epoxy compound, a curing agent, titanium oxide, a filler differing from titanium oxide, and a curing accelerator. One gram of the white curable composition for an optical semiconductor device is added to 10 g of a solution containing 5 g of acetone and 5 g of pure water, the solution is heated while stirring it at 80°C for 1 hour, and then an insoluble component in the solution after heating is removed by filtration, so as to obtain an extract. At this time, the pH of the extract is 3 or more and 6 or less. When an extract is similarly obtained by the method using 1 g of the heat-cured product, the pH of the extract is 6 or more and 7 or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
