发明名称 RESIN APPLICATION APPARATUS AND RESIN APPLICATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin application apparatus and a resin application method which achieve uniform light-emitting characteristics of an LED package and production yield improvement in a system for manufacturing the LED package, even when emission wavelengths of individual LED elements are fluctuated. <P>SOLUTION: In a resin application used for manufacturing an LED package obtained by covering LED elements with resin containing a fluorescent material, a transparent member 43 having resin 8 trial-applied for measuring light-emitting characteristics is mounted on a transparent member mounting part 41 including a light source part. Light-emitting characteristics of light emitted from the resin 8 is measured with a light-emitting characteristics measuring part 39 by irradiating the resin 8 applied to the transparent member 43 with excitation light emitted from the light source part. A deflection between a measurement result and prescribed light-emitting characteristics is found. Then, an appropriate amount of resin application of the resin that should be applied to the LED elements for an actual production is obtained on the basis of the deflection. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013038372(A) 申请公布日期 2013.02.21
申请号 JP20110175819 申请日期 2011.08.11
申请人 PANASONIC CORP 发明人 NONOMURA MASARU;UMEDA SHINJI
分类号 H01L33/52;H01L33/50 主分类号 H01L33/52
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