| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently proceed a series of operations from a characteristic inspection of a semiconductor element such as magnetic sensors through packaging without using a tray. <P>SOLUTION: An inspection processing method of a semiconductor element includes: a process for dividing each semiconductor element 10 in a state arranged in a matrix on a dicing tape 31; a probe inspection process for inspecting each semiconductor element 10 after placing it on each piece of dicing tape 31, and making it in contact with a probe by moving it towards horizontal and vertical directions; a first main surface inspection process for placing at least the one semiconductor 10 to which the probe inspection process is applied being picked up from the dicing tape 31, and inspecting the visual condition of a first main surface 10a of the semiconductor element 10 sequentially conveyed on a transport table 32; a second main surface inspection process for holding and inverting the semiconductor element 10 to which the first main surface inspection process is applied, and inspecting the visual condition of a second main surface 10b of the semiconductor element 10; and a packaging process for sequentially picking up the semiconductor element 10 to which the second main surface inspection process is applied and packaging it. <P>COPYRIGHT: (C)2013,JPO&INPIT |
