| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing/die-bonding film capable of preventing the ion trappability of an adhesive sheet from lowering even if an ion trappable adhesive sheet is adopted, and capable of preventing the electrical characteristics of a semiconductor device from deteriorating by trapping the metallic ions mixed into a semiconductor chip in the manufacturing process of the semiconductor device. <P>SOLUTION: The dicing/die-bonding film includes a dicing film having a substrate and an adhesive layer laminated thereon, and an adhesive sheet laminated on the adhesive layer. The adhesive layer contains an ion trapping agent capable of trapping metallic ions, and the storage modulus of the adhesive layer is 1.0×10<SP POS="POST">4</SP>Pa or higher and 1.0×10<SP POS="POST">7</SP>Pa or lower at 26°C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
