| 摘要 |
<p>A multi-layer, gas-barrier, biaxially oriented and heat-shrinkable film comprising a first outer heat-sealable layer a), an inner gas-barrier layer b), preferably of PVDC, and 5 a second outer abuse resistant layer c), said film being characterized in that at least one layer of the structure, that can be an inner layer d) or, preferably, the second outer abuse resistant layer c), is a polyamide layer that comprises a major proportion of one or more amorphous polyamides. Preferably the amorphous polyamides of said polyamide layer have a Tg 120 *C, more 10 preferably : I 10 C, and even more preferably ! 100 C. The invention also concerns the use of said films in a "thermoform-shrink" packaging process and the shrunk package obtained therefrom. 3(o t4 d C4a</p> |
