| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transfer technology which enables even a wafer having large warpage and repulsion to be transferred while securely attached and held. <P>SOLUTION: The substrate transfer system comprises a transfer pick 40 for transferring a substrate while attaching and holding the substrate. An attaching surface 40a of the transfer pick 40 is divided into a plurality of regions 46a, 46b, and an attaching path is provided for each of the regions. A control part 60 controls introduction of negative pressure to the attaching path to control action of the transfer pick 40 for attaching and holding the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
