| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve heat radiation performance while enabling low height form. <P>SOLUTION: In a component built-in multilayer printed board 100, first and third resin base materials 10 to 30 are laminated and an electronic component 40 is incorporated in a cavity 60. An electrode 41 of the electronic component 40 is directly joined to an electrode 12a of a through-hole electrode 12. Wiring and the like formed in the resin base materials 10 to 30 are respectively formed being embedded in the base materials without protruding both surfaces of the base materials. A non circuit surface 42 of the electronic component 40 incorporated in the cavity 60 contacts with wiring for heat radiation 21 and a via for heat radiation 32. Thus, the structure enables low height form and high density packaging and improves the heat radiation performance. <P>COPYRIGHT: (C)2013,JPO&INPIT |
