| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a wide exposure margin when a pattern is formed. <P>SOLUTION: The photosensitive resin composition contains a resin, a polymerizable compound and a polymerization initiator. The resin comprises a polymer having a structural unit derived from at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides. The polymerization initiator contains a compound expressed by formula (1). In formula (1), R<SP POS="POST">a1</SP>and R<SP POS="POST">a2</SP>each represent R<SP POS="POST">a11</SP>, OR<SP POS="POST">a11</SP>, COR<SP POS="POST">a11</SP>, SR<SP POS="POST">a11</SP>, CONR<SP POS="POST">a12</SP>R<SP POS="POST">a13</SP>or CN; R<SP POS="POST">a11</SP>, R<SP POS="POST">a12</SP>and R<SP POS="POST">a13</SP>each represent a hydrogen atom, a 1-20C alkyl group, or the like; R<SP POS="POST">a3</SP>and R<SP POS="POST">a4</SP>represent R<SP POS="POST">a11</SP>or the like; s and t each represent an integer of 0 to 4; L represents an oxygen atom, sulfur atom, selenium atom, CR<SP POS="POST">a31</SP>R<SP POS="POST">a32</SP>, CO, NR<SP POS="POST">a33</SP>or PR<SP POS="POST">a34</SP>; and R<SP POS="POST">a5</SP>represents a hydroxy group, a carboxyl group, or the like. <P>COPYRIGHT: (C)2013,JPO&INPIT |
