| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a chip component structure which effectively cleans a clearance between an interposer and a circuit board after the interposer, equipped with a multilayer capacitor, is mounted on the circuit board. <P>SOLUTION: A chip component structure 1 comprises an interposer 3 equipped with a multilayer capacitor 2. The interposer 3 comprises: a substrate 31; electrodes for component connection 32A, 32B; electrodes for external connection 33A, 33B; and side surface electrodes 34A, 34B. The electrodes for the component connection 32A, 32B are electrically connected with the electrodes for the external connection 33A, 33B through the side surface electrodes 34A, 34B. External electrodes of the multilayer capacitor 2 are joined to the electrodes for the component connection 32A, 32B. A communication hole 39B communicating spaces which are opened on both main surfaces and face each other is formed in the substrate 31. <P>COPYRIGHT: (C)2013,JPO&INPIT |
