| 发明名称 |
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a crack from developing along a grinding mark that is formed on the back surface of a semiconductor chip. <P>SOLUTION: The semiconductor chip 1 includes a groove 4 that is formed along at least each of two sides facing each other one by one so as to pass across the grinding mark 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013035038(A) |
申请公布日期 |
2013.02.21 |
| 申请号 |
JP20110173759 |
申请日期 |
2011.08.09 |
| 申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
TAZAWA MASAYA;SHINJO YOSHIAKI;YOSHIMOTO KAZUHIRO |
| 分类号 |
B23K26/00;H01L21/301 |
主分类号 |
B23K26/00 |
| 代理机构 |
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