HOT-MELT RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a hot-melt resin composition for sealing, which has satisfactory blocking resistance for use in electric and electronic components having complicated shapes.

SOLUTION: The hot-melt resin composition includes an anti-adhesive agent adhered to the surface. The main component of the anti-adhesive agent is a plant-derived particle. The average particle size of the particle is 5-40 μm, and the surface of the particle is coated with silicone. The melting point of the plant-derived particle is 180°C or higher.

COPYRIGHT: (C)2013,JPO&INPIT