| 摘要 |
A first presspin includes a foot, whereby a base of the foot is provided for contacting a contact element of a power semiconductor device, such as within a power semiconductor module including a base plate and at least one power semiconductor device, which is arranged on the base plate and contacted by at least one further presspin. An insulation means is provided for electrically an outer surface of the foot. A power semiconductor module is also provided including a base plate, at least one power semiconductor device arranged on the base plate, and at least one of the aforementioned first presspin provided with the aforementioned insulation means. A power semiconductor module assembly is also provided including multiple power semiconductor modules as specified above, whereby the power semiconductor modules are arranged side by side to each other with electric connections between adjacent power semiconductor modules. |
