| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package which inhibits package warpage even if a circuit board is thin. <P>SOLUTION: A semiconductor package sequentially has: (an A layer) a thin film layer 2 having the elastic modulus ranging from 5 to 25 GPa; (a B layer) a sealing layer 3 having the elastic modulus ranging from 0.1 to 1 GPa; and (a C layer) a circuit board layer 4. The thickness of the A layer 2 ranges from 1 to 200 μm, the thickness of the B layer 3 ranges from 100 to 600 μm, and the thickness of the C layer 4 ranges from 1 to 100 μm. The package warpage is 235 μm or smaller. <P>COPYRIGHT: (C)2013,JPO&INPIT |
