| 摘要 |
<p>A semiconductor manufacturing device (10) according to one embodiment is provided with a stage (ST), a plurality of pins (70), and a driving unit (74). The stage (ST) includes a placement surface (PF). The placement surface (PF) has a first region (R1) for placing a substrate (W) to be treated, and a second region (R2) for placing a focus ring (18). The second region (R2) is provided so as to surround the first region (R1). A plurality of holes (14h) are formed on the stage (ST). The holes (14h) extend in a direction that passes through the boundary between the first region (R1) and the second region (R2) and intersects the placement surface (PF). The pins are provided to each of the holes. Each of the pins has a first top end surface (70a) and a second top end surface (70b). The second top end surface (70b) is provided further above the first top end surface (70a), and is disposed further towards the side of the first region (R1) than the first top end surface (70a). The driving unit (74) moves the pins (70) up and down in the aforementioned direction.</p> |
