发明名称 METHOD FOR ETCHING COPPER/MOLYBDENUM ALLOY FILM WITH INCREASED ETCHING CAPACITY OF ETCHANT
摘要 The present invention relates to a method for increasing the etching capacity of a copper/molybdenum alloy film used in the manufacture of TFT-LCD. The method of the present invention can increase the etching capacity of an etchant by recovering the degradation of etching properties such as an etch rate, a taper profile, and etch linearity which are generated when etching is repeated using the etchant with the copper/molybdenum alloy film, thereby substantially reducing production costs for TFT-LCD, and the like.
申请公布号 WO2013025003(A2) 申请公布日期 2013.02.21
申请号 WO2012KR06329 申请日期 2012.08.09
申请人 ENF TECHNOLOGY CO., LTD.;SHIN, HYOSEOP;JEONG, JINBAE;KIM, SEHOON;LEE, EUNKYUNG 发明人 SHIN, HYOSEOP;JEONG, JINBAE;KIM, SEHOON;LEE, EUNKYUNG
分类号 H01L21/3063;H01L29/786 主分类号 H01L21/3063
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