| 摘要 |
A method for manufacturing a semiconductor device is provided in which the mounting of a semiconductor chip on a circuit substrate and the sealing of the semiconductor chip are preformed simultaneously in a single thermal pressure bonding treatment using a sealing resin film including a thermosetting sealing resin layer having a predetermined thickness. The method is characterized by temporarily securing the semiconductor chip to the circuit substrate with a thermosetting adhesive film interposed therebetween; disposing on the temporarily secured semiconductor chip the sealing resin film including a release film and the thermosetting sealing resin layer laminated on the release film and having a thickness of 0.5 to 2 times the thickness of the semiconductor chip, the sealing resin film being disposed such that the thermosetting sealing resin layer faces the semiconductor chip; bonding and securing the semiconductor chip to the circuit substrate and simultaneously sealing the semiconductor chip with the resin by applying heat from the circuit substrate side while pressure is applied by a rubber head having a rubber hardness of 5 to 100 from the release film side; and peeling off the release film on a front side. |
