| 摘要 |
Provided is a mould release film that has embedding characteristics superior to previous PBT-type mould release films while preventing clinging between the circuit exposure film of a mould release layer and a cover lay (CL) film and between mould release layers, when the CL film is adhered to the circuit exposure film. The disclosed mould release film (100) is provided with a release layer (110) that includes, at least, a polybutylene terephthalate homopolymer (A) and a polybutylene terephthalate (PBT)/polytetramethylene glycol (PTMG) copolymer (B). |
