| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit device which prevents leakage of sealing resin in the middle stage of production process while increasing the packaging density, and to provide its production process. Ž<P>SOLUTION: A first circuit board 18 and a second circuit board 20 superimposed on a case material 12 are incorporated in a hybrid integrated circuit device 10. A first circuit element 22 is arranged on the upper surface of the first circuit board 18 and a second circuit element is arranged on the upper surface of the second circuit board 20. Furthermore, a lead 28 bonded to a pad 38A on the first circuit board 18 is arranged to be led out while penetrating the second circuit board 20. The lead 28 includes a first lead 28A which is connected with the second circuit element 24 mounted on the second circuit board 20, and a lead 28 which is not connected with the second circuit element 24. A through hole 15 for passing the first lead 28A is filled with a bonding material 17, and a through hole 15 for passing the second lead 28B is also filled with a bonding material 17. Ž<P>COPYRIGHT: (C)2009,JPO&INPIT Ž</p> |
