| 摘要 |
<p>A sheet peeling apparatus 10 includes: a holding means 11 for holding a wafer W on which an adhesive sheet S is stuck; a sticking means 16 for sticking a peeling tape PT on the adhesion sheet S; and a peeling means 15 for peeling off the adhesive sheet S from the wafer W through the peeling tape PT. The peeling means 15 has first and second rollers 31, 32 between which the peeling tape PT and the adhesive sheet S may be pinched. The first roller 31 is provided such that a peeled section of the adhesive sheet S and an unpeeled section of the adhesive sheet S are bendable so as to be opposed to each other. The first roller 31 is displaced in a direction toward and away from the wafer W through a displacing means 30, and provided such that the peeling angle α between the peeling tape PT and/or the adhesive sheet S and the wafer W may be adjusted.</p> |
