发明名称 |
SURFACE TREATED COPPER FOIL, PROCESS FOR PRODUCING SURFACE TREATED COPPER FOIL, AND SURFACE TREATED COPPER FOIL WITH VERY THIN PRIMER RESIN LAYER |
摘要 |
It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m 2 and a tin layer having a thickness by weight of 5 to 40 mg/m 2 stacked in this order, and the rust-proofing layer is provided with the silane coupling layer on the surface is applied. Also a surface-treated copper foil coated with a very thin primer resin layer, comprising the surface-treated copper foil according to the present invention (without roughening treatment), and a very thin primer resin layer having a thickness by calculation of 0.5 to 5-micron meter provided on the bonding surface of the surface-treated copper foil to the insulating resin substrate is applied. |
申请公布号 |
EP1911860(B1) |
申请公布日期 |
2013.02.20 |
申请号 |
EP20060766606 |
申请日期 |
2006.06.12 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
MATSUNAGA, T. |
分类号 |
C23C28/00;H05K1/00;H05K1/05;H05K3/02;H05K3/38 |
主分类号 |
C23C28/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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