发明名称 ADHESIVE COMPOSITION FOR E-PAPER
摘要 <p>PURPOSE: An adhesive composition for electronic paper is provided to have excellent solvent resistance by satisfying the condition of the content of 85% or more after hardening when used for an encapsulant material for an organic solvent. CONSTITUTION: An adhesive composition for electronic paper satisfies the condition of a chemical formula 1: X=85% or more. In the chemical formula 1, X is a gel content which is measured after dipping the adhesive composition in a polar solvent for 24-48 hours, and drying the same at 110 deg. C for 2 hours. The adhesive composition comprises a radiation polymerizable compound and a photopolymerization initiator, and additionally comprises a polyfunctional monomer. The radiation polymerizable compound is an acrylate-based compound which has two or more double bonds in the structure thereof.</p>
申请公布号 KR20130017733(A) 申请公布日期 2013.02.20
申请号 KR20110080340 申请日期 2011.08.11
申请人 LG HAUSYS, LTD. 发明人 KIM, JANG SOON;LEE, YONG HOON
分类号 C09J133/06;C09J4/00;C09J7/02;G02F1/167 主分类号 C09J133/06
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