| 摘要 |
FIELD: electrical engineering.SUBSTANCE: method for manufacture of a 3D electronic module includes the operations of preliminary gluing components to the masks using sublimating glue, butt-end masks application for spraying semiconductors onto the components and microplates butt-end surfaces, application of a heat spreading agent levelling the thermal background across the whole of the modules. The technology is based on application of standard technological equipment.EFFECT: creation of a technological process for manufacture of a 3D electronic module and components thereof to provide for high packing density, a sparing thermal mode of work, the possibility to operate such kind equipment under inclement climatic, mechanical and radiation conditions with the module repairability preserved until complete depressurisation.4 cl, 11 dwg |
