| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a structure which is suitable for suppressing stress generated in a mold resin in a substrate caused by a stress relaxation layer, as uniformly as possible in a substrate, when the stress relaxation layer is provided for an electronic device of a half mold structure formed by sealing the substrate on one side of which electronic components are mounted with the mold resin and exposing the other side of the substrate from the mold resin. Ž<P>SOLUTION: The stress relaxation layer 60 which has a Young's modulus lower than that of the mold resin 30 is arranged in a peripheral section which is a region outside a region where the electronic components 20 and 50 are arranged on one surface of the substrate 10 sealed with the mold resin 30. The peripheral section of one surface of the substrate 10 and the mold resin 30 are closely attached to each other via the stress relaxation layer 60. A region 61 of the stress relaxation layer 60 which is closer to the end of the periphery of one surface of the substrate 10 is constituted as a thick region 61 whose thickness is large. A region 62 which is closer to the center of one surface of the substrate 10 is constituted as a thin region 62 whose thickness is small. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž |
