| 摘要 |
<p>A groove (27) is formed above a first group of interconnects (21, 23a) of a first substrate, continuously extending along a substrate outer perimeter portion and across the first group of interconnects (21, 23a). An underlying metal (27a) is provided in the same layer in which a second group of interconnects (23) are provided, below the groove (27) in at least regions in which the groove (27) overlaps the first group of interconnects (21, 23a) as viewed from above.</p> |
